Market Insight-Global Low Dielectric Glass Fibre Market Overview 2025
Global Low Dielectric Glass Fibre Market Was Valued at USD 350.33 Million in 2024 and is Expected to Reach USD 2478.25 Million by the End of 2033, Growing at a CAGR of 23.81% between 2025 and 2033.– Bossonresearch.com
The Low Dielectric Glass Fibre market encompasses the production and supply of glass fiber materials specifically engineered to have a low dielectric constant (Dk) and low dissipation factor (Df), which are critical for reducing signal loss and delay in high-frequency electronic applications. These fibers serve as reinforcement materials in substrates for high-speed printed circuit boards (PCBs), electromagnetic windows, and advanced communication systems. The market includes various types such as D-Glass and Glass Fabrics, each offering unique dielectric and thermal properties suited for different performance requirements. As the demand for faster, more reliable data transmission grows—driven by technologies like 5G, autonomous vehicles, and advanced computing—the need for low dielectric materials is rising, making low dielectric glass fiber a foundational material in next-generation electronics.
The Low Dielectric Glass Fiber market encompasses the production and supply of glass fiber materials specifically engineered to have a low dielectric constant (Dk) and low dissipation factor (Df), which are critical for minimizing signal loss and delay in high-frequency electronic applications. These fibers serve as reinforcement materials in substrates for high-speed printed circuit boards (PCBs), electromagnetic windows, and advanced communication systems. The market includes various types such as Glass Yarn and Glass Fabric, each offering unique dielectric and thermal properties tailored to different performance requirements. As demand for faster, more reliable data transmission grows—driven by technologies like 5G, autonomous vehicles, and advanced computing—the need for low dielectric materials is increasing, making low dielectric glass fiber a foundational material for next-generation electronics.
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At the same time, the global market landscape is shifting. Although Japanese and Taiwanese companies have traditionally dominated, Chinese manufacturers such as Taishan Fiberglass and Henan Guangyuan are rapidly expanding production capacity to meet rising domestic demand and respond to global supply chain adjustments. With limited capacity expansion from established players and growing demand for local sourcing amid geopolitical tensions, China is poised to capture a larger share of the global market.
The global low dielectric glass fiber market was valued at approximately USD 350.33 million in 2024 and is expected to grow at a compound annual growth rate (CAGR) of about 23.81% from 2024 to 2033. This growth is primarily driven by surging demand linked to 5G infrastructure buildout, high-performance computing, and advanced automotive electronics. Additionally, the rapid expansion of data centers and servers to support cloud computing and AI workloads fuels the need for materials with superior signal transmission properties. Consumer electronics manufacturers are also prioritizing lighter, faster devices, increasing the adoption of low dielectric substrates to achieve higher data rates and reduce power loss. The automotive sector’s growing integration of advanced driver-assistance systems (ADAS), vehicle-to-everything (V2X) communications, and electric vehicle platforms further boosts demand for high-frequency circuit boards that benefit from low dielectric materials. The convergence of these technological advancements and miniaturization trends across industries underpins market expansion and highlights the strategic importance of low dielectric glass fiber in high-speed electronic applications.
Figure 1. Figure Global Low Dielectric Glass Fibre Market Size (M USD)
Source: Bossonresearch.com, 2025
Low Dielectric Glass Fibre Industry Chain Analysis
Figure 2. Industry Chain Map of Low Dielectric Glass Fibre
Source: Secondary Sources, 2025
Driving Factors
Expansion of the High-Performance Printed Circuit Board (PCB) Market
With the rapid development of electronic products, printed circuit boards (PCBs) have become the core platform connecting electronic components, and their performance directly affects the stability and efficiency of the entire electronic system. In recent years, demand for high-frequency, high-speed, and high-density PCBs has continuously increased across consumer electronics, communication equipment, automotive electronics, and industrial control fields. Low-dielectric glass fiber is a key reinforcing material in high-performance PCBs, whose low dielectric constant (Dk) and low dielectric loss factor (Df) help improve signal transmission speed and reduce transmission loss, making it an ideal choice for manufacturing high-end PCB materials such as copper clad laminates.
According to Prismark statistics, the global PCB market size grew from USD 48.3 billion in 2008 to USD 69.5 billion in 2023. Although there was a decline in 2023 due to weak smartphone and PC consumption, the global market is expected to reach USD 90.4 billion by 2028, with a compound annual growth rate (CAGR) of 5.4%. Under this steady growth trend, the performance standards of the entire PCB material system are being upgraded synchronously, increasing dependence on low-dielectric substrates.
Moreover, as product forms evolve towards miniaturization, multifunctionality, and high-frequency operation, traditional E-glass fibers are gradually being phased out due to their relatively high dielectric constant and loss. Low-Dk glass fibers reduce signal crosstalk and loss, supporting higher data transmission rates and becoming the preferred reinforcing material for advanced PCBs such as high-speed interconnect boards, ABF substrates, and HDI boards.
Therefore, the continuous expansion of the high-performance PCB market directly drives the growth in demand for low-dielectric glass fibers, making this material one of the indispensable raw materials for high-end electronics manufacturers during product upgrades.
Growth of AI Server and High-Frequency Communication Demand
The large-scale commercialization of artificial intelligence and the technical deployment of 6G communication are two revolutionary advances in the electronics industry in recent years, posing unprecedented challenges to materials, especially low-dielectric materials. AI servers handle massive algorithms and parallel data computations, requiring PCBs that support more chips and more complex signal paths internally. Therefore, the requirements for electromagnetic compatibility and high-speed transmission performance are extremely high.
With the rapid development and application of AI technology, the surge in AI computing power demand drives the growth of AI servers. AI servers need to support complex tasks such as large-scale data processing and inference calculations, raising performance, efficiency, and stability requirements. As the basic platform carrying processors, memory, and network interfaces, PCBs must provide robust support for AI servers’ data and signal transmission, imposing higher demands on signal transmission loss and speed.
Meanwhile, although 6G communication has not yet been fully commercialized, research and development have reached high-frequency millimeter-wave and even terahertz bands. Its higher frequency and stronger energy impose stricter dielectric property requirements on PCB materials. Traditional E-glass fabrics have excessive dielectric loss at GHz-level frequencies, causing severe signal distortion, while D-glass fibers or more advanced low-dielectric glass fiber reinforcement materials can effectively meet these challenges.
High-performance electronic fabrics are ideal materials to meet the high-performance PCB requirements in AI servers, 6G high-frequency communications, and other fields. Due to current limited production capacity, the supply-demand gap for Low-Dk electronic fabrics is expected to persist until 2026, with a current supply shortfall of 10–20%. In addition to the first-generation electronic fabrics having been supplied in batches, second- and third-generation electronic fabrics (quartz fiber fabrics) are also in R&D and pilot production stages.
Rapid Development of New Energy Vehicles and Intelligent Driving
The electrification and intelligentization of new energy vehicles (NEVs) are driving rapid upgrades of in-vehicle electronic systems. Traditional vehicles only required basic control and entertainment systems, whereas current NEVs are equipped with multiple modules including autonomous driving, intelligent cockpits, advanced driver-assistance systems (ADAS), and battery management systems (BMS), all relying on high-performance PCBs for data processing and transmission.
As in-vehicle communication migrates from CAN bus to high-speed buses such as Ethernet, the requirements for signal integrity, anti-interference capability, and high-speed transmission in electronic systems have increased significantly. Low-dielectric glass fiber reinforcement materials help achieve highly reliable, low-loss PCB substrates and are ideal for automotive high-frequency and high-speed communication modules, especially in ADAS radar control, vehicle antennas, and high-speed computing control systems.
Furthermore, NEVs operate in more extreme environments (such as high temperature, high humidity, and strong vibration), placing higher demands on the mechanical strength and environmental stability of glass fiber substrates. The new generation of low-dielectric glass fibers not only has electrical performance advantages but also exhibits superior moisture resistance, heat resistance, and dimensional stability, adapting to the long-term use of NEVs under complex working conditions.
As global NEV penetration continues to increase, especially in China, Europe, and the United States, the market space for automotive high-end PCBs will continuously expand, further driving the penetration of low-dielectric glass fibers in the automotive electronics field.
Key Development Trends
High-Speed Copper-Clad Laminate Technology Moving Toward Lower Df and Lower Dk
The upgrade of communication technology is driving the copper-clad laminate (CCL) industry toward “high-frequency, high-speed” development. In the 5G era, communication frequencies have already risen to 5 GHz or even above 20 GHz bands, with transmission rates reaching 10 to 20 Gbps or higher. High-frequency signals are more prone to attenuation and loss during transmission. On the other hand, their propagation within the dielectric is influenced and limited by the inherent properties of the copper-clad laminate itself, which can lead to signal distortion or even loss. Therefore, the electrical performance requirements for copper-clad laminates in high-frequency, high-speed applications are very demanding. According to Edward A. Wolff’s formula: transmission loss increases with higher dielectric loss factor (Df) and higher dielectric constant (Dk). High-frequency, high-speed copper-clad laminates with low dielectric constant (Dk) and low dielectric loss factor (Df) have become the mainstream development trend in the industry, where low loss factor is the most important and core performance.
As data transmission rates increase, the Df grade of copper-clad laminates is getting lower and lower. High-frequency, high-speed copper-clad laminate materials mainly address the instability and high loss issues of ordinary copper-clad laminates in microwave and millimeter-wave frequency transmissions in communications. With applications in 5G, AI, cloud computing, and big data, these materials have become the mainstream technology and trend in the entire industry. As next-generation 6G terrestrial and satellite interconnect and cloud computing communications impose higher demands on equipment and interconnects, high-speed copper-clad laminate technology must evolve toward lower Df and lower Dk.
High Frequency and Low Dielectric Loss Factor
By comparing products and summarizing the development directions of low-dielectric fibers from Nittobo, AGY, Taiwan Glass, Henan Guangyuan New Material, and Taishan Fiberglass, it is found that low dielectric glass fibers generally develop toward high frequency and low dielectric loss factor. At 10 GHz, the dielectric constant Dk is less than 4.7 and the Df less than 0.0028. To compete in the market, manufacturers generally develop and reserve low dielectric glass fibers with even lower loss factors (Df ≤ 0.002). As loss decreases, glass fiber strength declines, and glass clarification becomes more difficult. The fiber forming performance and the production of hollow fibers become technical challenges. Therefore, producing low-loss glass fibers with low hollow fiber index not only tests glass fiber formulation development and iteration technology but also involves the contest of high-temperature clarification technology and fiber forming technology.
Material System Innovation
To achieve a balance between low dielectric properties, spinnability, moisture resistance, and thermal stability, global glass fiber manufacturers continuously optimize glass formulation systems. Traditional E-glass contains relatively high alkali metal oxides (such as Na₂O, K₂O), resulting in poor dielectric performance. New-generation low-dielectric glass fibers usually use low-alkali or even alkali-free systems to improve dielectric performance and signal integrity.
Current mainstream research directions include reducing SiO₂ content and properly introducing B₂O₃ to lower the dielectric constant, adding appropriate amounts of TiO₂, ZnO, MgO, and other metal oxides to improve spinnability and chemical stability while avoiding glass crystallization. Additionally, some manufacturers try to introduce special fluxing agents such as F and P₂O₅, which lower the glass melting point without sacrificing dielectric performance.
However, in actual industrial processes, problems such as nozzle adhesion, fiber breakage during drawing, and thermal expansion mismatch still exist, limiting the mass production stability of some low-dielectric glass fibers. In particular, high B₂O₃ content glass tends to form viscous blockage at the drawing nozzle during high-temperature spinning, requiring precise control of composition ratios and process parameters.
Therefore, the current industry shows a dual-track innovation path of “formulation optimization + process synergy.” Some companies collaborate with PCB material firms to jointly develop low-dielectric glass formulations better adapted to downstream resin systems, optimizing dielectric performance and production stability from a system perspective.
Global Low Dielectric Glass Fibre Market: Competitive Landscape
Market concentration analysis indicates a moderately concentrated global low dielectric glass fiber manufacturing sector. The top five companies—Nittobo, Saint-Gobain Vetrotex, AGY, Taiwan Glass, and Henan Guangyuan New Material—held about 60% market share in 2023 and 2024, which is expected to slightly decline to 58.82% by 2025. This reflects a small decrease in concentration ratio (CR5) as emerging players increase their market share. Correspondingly, the Herfindahl-Hirschman Index (HHI) remains stable but shows a slight downward trend, dropping from 7.93% in 2024 to 7.08% in 2025, indicating intensifying competition. This trend aligns with industry expansion and increased production capabilities of new entrants, especially in Asia, which could challenge traditional leaders and stimulate innovation and price competition. Key current market participants include Nittobo, Saint-Gobain Vetrotex, AGY, Taiwan Glass, Asahi Kasei, Henan Guangyuan New Material, CPIC, Taishan Fiberglass, and Sichuan Glass Fiber.
Key players in the Low Dielectric Glass Fibre Market include:
Nittobo
Saint-Gobain Vetrotex
AGY
Taiwan Glass
Asahi Kasei
Henan Guangyuan New Material
CPIC
Taishan Fiberglass
Sichuan Glass Fiber
Others
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