Market Insight-Global IC Tray Market Overview 2025
Global IC Tray Market Was Valued at USD 331.33 Million in 2024 and is Expected to Reach USD 513.98 Million by the End of 2033, Growing at a CAGR of 4.90% Between 2025 and 2033.– Bossonresearch.com
An IC tray, also known as an integrated circuit tray or chip tray, is a specialized component carrier designed for the safe storage, handling, and transportation of semiconductor components such as microchips, ICs, and other delicate electronic devices. These trays are typically made from high-performance engineering plastics such as polycarbonate, PPS, or PEEK, and are often ESD-safe (electrostatic discharge resistant) to protect sensitive devices from static damage. They are engineered to meet JEDEC standards to ensure compatibility with automated manufacturing and assembly equipment. IC trays are crucial in the semiconductor supply chain as they help minimize mechanical and electrostatic damage during logistics, facilitate high-speed pick-and-place operations in SMT (surface mount technology) lines, and optimize storage in cleanroom environments.
In 2024, the global IC tray market was estimated to be valued at approximately USD 331.33 million, driven by the consistent growth of semiconductor demand across consumer electronics, automotive electronics, and industrial applications. Looking forward, the market is expected to grow at a compound annual growth rate (CAGR) of around 4.90% from 2024 to 2033, reaching a projected market size of approximately USD 513.98 billion by 2033. This sustained growth is underpinned by several key drivers. Firstly, the increasing complexity and miniaturization of semiconductor devices have necessitated the use of highly engineered packaging and handling solutions. Secondly, the rise of 5G, AI chips, and IoT technologies has led to an expanding variety of IC designs, which in turn demand customized and protective packaging like IC trays. In addition, the globalization of the semiconductor supply chain and the rising automation in chip manufacturing and assembly facilities have further increased the need for standardized and reliable IC handling solutions.
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Figure 1. Figure Global IC Tray Market Size (M USD)
Source: Bossonresearch.com, 2025
IC Tray Industry Chain Analysis
Figure 2. Industry Chain Map of IC Tray
Source: Secondary Sources, 2025
Driving Factors
Semiconductor Industry Expansion
IC trays are indispensable materials in the semiconductor packaging process, and their demand is closely tied to the growth of the semiconductor industry. With the rise of advanced applications such as AI, high-performance computing, automotive electronics, and 5G, chip packaging is becoming increasingly complex—evolving from traditional single-chip packages (such as QFN and BGA) to 2.5D, 3D, and Chiplet modular packaging. These packaging types place higher demands on manufacturing precision, thermal management, and electrostatic control, increasing the dependency on trays during chip transportation and testing.
By 2025, the gradual recovery of the consumer electronics industry will help stabilize the global semiconductor market. Meanwhile, the industrial semiconductor sector is also expected to experience slow recovery. AI and automotive applications are projected to be the two key growth drivers. According to WSTS, the global semiconductor market is forecast to reach USD 700.9 billion in 2025, representing an 11.2% year-on-year increase. The long-term expansion of the semiconductor industry provides the most direct and fundamental momentum for the IC tray market.
As essential carriers for chip packaging, transportation, testing, and storage, the demand for IC trays grows almost in parallel with chip production. Under the backdrop of advanced processes and high yield requirements, the turnover frequency per chip has also significantly increased. The IC tray market is thus expected to grow rapidly along with the semiconductor industry's recovery cycle.
Packaging Technology Advancement and Complexity
The rapid evolution of chip packaging technologies continues to drive upgrades in IC tray products. Packaging has progressed from early DIP and QFP to current BGA, CSP, Fan-Out, 2.5D/3D integrated packaging, and now Chiplet heterogeneous modules. Each generation of packaging technology imposes increasingly stringent requirements on tray structure, precision, and functionality.
Advanced packaging involves more complex chip structures, finer features, and denser interfaces, requiring trays to provide high-precision alignment to ensure stability during testing and packaging. In addition, to prevent damage to microstructures and electrostatic discharge, trays must have strong anti-static performance. Some high-end packaging even requires surface resistance in the range of 10^5 to 10^9 ohms.
Progress in Materials and Manufacturing Technologies
As semiconductor processes place higher functional demands on trays, the development and application of tray materials have become a core industry competitiveness factor. Traditional IC trays made from general-purpose plastics like ABS and HIPS can no longer meet requirements such as high temperature resistance, cleanliness, and anti-static properties. Modern packaging and testing demand multiple material performance indicators, including low particle shedding, high thermal resistance, dimensional stability, and low outgassing.
Currently, high-strength, high-temperature-resistant materials such as PEEK (polyether ether ketone), PEI, and nanocomposites are widely used to replace conventional plastics, ensuring tray performance under extreme conditions. For example, PEEK can withstand continuous temperatures up to 250°C and has excellent dimensional stability and chemical inertness, making it ideal for high-end packaging and high-temperature burn-in testing. However, these high-performance materials are costly and difficult to process, posing higher requirements for mold design and injection molding precision.
Meanwhile, material suppliers and tray manufacturers are collaborating to develop composite modified materials with anti-static properties to enhance functionality while controlling costs. The advancement of precision injection molding technology now enables micron-level dimensional control, and the adoption of automated production lines significantly reduces defect rates and production costs.
Global Expansion of Packaging and Testing Capacity
Driven by geopolitical factors, supply chain security, and cost control, the global semiconductor manufacturing industry is accelerating a multipolar deployment strategy. In addition to East Asia (Mainland China, Taiwan, Japan, South Korea), regions such as Southeast Asia (Malaysia, Vietnam, Thailand), the United States, India, and the Middle East are emerging as new hubs for packaging and testing.
This global expansion of packaging capacity increases the demand for localized tray manufacturing and delivery capabilities. As IC trays serve as essential carriers in international packaging workflows, they must support rapid delivery, meet regional standardization, and ensure clean transportation. Tray manufacturers with globally distributed production networks (such as Entegris, ePAK, and ITW) are gaining larger market shares, while mid-sized suppliers with local responsiveness are also seeing growth opportunities.
Strong Growth in End-User Demand
The robust growth in IC tray market demand is fundamentally driven by the rapid expansion of downstream chip application scenarios. As semiconductors play an increasingly vital role across various industries, chip shipments continue to rise, directly boosting the overall demand for IC trays in packaging and testing. This growth is not only reflected in quantity but also in the increasing complexity of tray performance and specifications.
AI and high-performance computing are among the fastest-growing chip application areas. AI chips such as GPUs and TPUs are widely deployed in data centers, large model inference systems, and AI-enabled devices, demanding new standards for packaging density, thermal structures, and signal connections. These chips often use 2.5D/3D packaging or Chiplet heterogeneous integration, requiring high-precision, low-particle, high-strength trays for packaging, burn-in testing, and transportation to ensure device integrity and consistency.
The automotive-grade chip market is also seeing significant growth, driven by new energy vehicles and intelligent driving. Automotive MCUs, sensor chips, and power devices require high reliability and environmental adaptability. IC trays used in automotive chip production must feature anti-static, anti-warping, and high-temperature resistance, and must endure repeated use and long-term circulation. Customized trays have become the mainstream in this segment, increasing the overall value of the market.
Furthermore, with the gradual recovery of the global consumer electronics market, rising shipments of smartphones, wearable devices, and tablets are also generating substantial demand for standardized chip packaging. These chips typically use general-purpose trays for mass transportation and testing, requiring compatibility, cost-effectiveness, and robust supply chain delivery capabilities.
Key Development Trends
Upgrading Toward Ultra-Precision and High-Functionality Trays
The future of IC trays is evolving from simple "transport carriers" to "functional process carriers." High-end chips such as AI processors, automotive SoCs, and Chiplet modules demand trays with stricter performance requirements in terms of dimensional precision, electrostatic control, thermal stability, and cleanliness. This drives tray design toward high customization and diversified material selection, including PEEK, conductive PEI, and PPSU.
Moreover, design tolerances for tray cavities are being compressed to ±0.02mm or even smaller. Some applications are also integrating functional modules such as reverse recognition encoding, batch traceability, and surface energy control. The industry is shifting from standard tray models to highly customized solutions, requiring manufacturers to adapt tray grid sizes, positioning structures, and anti-static treatment zones based on chip size, thickness, packaging type, and thermal management needs.
Increased Use of Plastic Materials
Plastic IC trays are increasingly replacing other materials due to advantages such as lightweight, good toughness, ease of molding, and lower costs—especially in optics and packaging industries. However, the higher functional requirements—better plasticity, wear resistance, and impact toughness—demand significant advancements in tray material composition, injection molding processes, equipment, and tooling. These enhancements are crucial to ensuring high surface quality for plastic IC trays used as glass substitutes.
With the continued advancement of semiconductor packaging technologies, chips are increasingly exposed to extreme thermal environments during processing, testing, and packaging. Traditional materials like PS and PPS are gradually becoming insufficient. The industry is therefore transitioning toward high-performance engineering plastics such as PEEK, PES, and PEI to meet evolving temperature and cleanliness standards.
Greener and More Circular Design
Driven by ESG policies and green supply chain demands, IC trays are shifting from single-use consumables toward recyclable, maintainable, and reusable products. Major semiconductor companies are setting tray reuse targets and requiring suppliers to evaluate carbon footprints, meet RoHS/REACH compliance, and use environmentally friendly materials.
Companies like Phicom have entered the IC tray recycling market, and semiconductor giants are following suit. For example, SK Hynix became the first large enterprise certified by South Korea's Ministry of Environment for “circular resource use” and qualified for tray recycling in 2019.
As a result, future tray designs will prioritize washability, maintainable structures (e.g., replaceable pads or labels), and materials with biodegradability or low-carbon properties. These trends are encouraging suppliers to develop closed-loop recycling systems—such as rental tray management, periodic recycling and reprocessing, and carbon credit return mechanisms—boosting sustainability and customer loyalty.
Supply Chain Localization and Distributed Production
Geopolitical factors are reshaping global semiconductor manufacturing, expanding beyond China, Japan, and South Korea into the U.S., Southeast Asia, Europe, and India. IC tray supply chains must adjust accordingly. Customers now prioritize local delivery capabilities, fast response times, and customized development services, prompting tray manufacturers to establish modular plants, warehousing, and cleaning centers in key regions.
Leading tray companies are adopting a "centralized design + localized production" strategy, where headquarters standardize platforms and materials, while regional sites replicate molds, run injection lines, and host cleaning and inspection systems. This enables flexible, high-frequency regional delivery, allowing for “hour-level” order fulfillment.
Global IC Tray Market: Competitive Landscape
Market concentration remains moderate as of 2024. The top five manufacturers (CR5)—Daewon, Entegris, Mishima Kosan, ITW, and Sunrise—are projected to hold a combined market share of 36.34% in 2025, slightly down from 37.08% in 2023. Meanwhile, the Herfindahl-Hirschman Index (HHI) is expected to decline modestly from 2.80% in 2023 to 2.68% in 2025, indicating increasing fragmentation driven by the rise of smaller and regional players, particularly in cost-sensitive and localized markets. Looking ahead, selective consolidation may occur, especially to respond to materials innovation and growing customization demands; however, the overall market concentration is expected to remain low to moderate in the medium term.
Current key players in the global IC tray market include Daewon, Entegris, Mishima Kosan, ITW, Sunrise, Peak International, HWA SHU, NISSEN CHEMITEC CORPORATION, SHINON, Kostat, Shenzhen Hiner Technology Co., Ltd., Baiyu Packaging Material Tech Co., Ltd., Tateyama, ZSPAK, RH Murphy Company, TOMOE Engineering, ePAK International, Zhejiang Jiemei Electronic And Technology Co., Ltd., CHYANG YEOU, and Daiwa.
Figure 3. The Global 5 Largest Players: Market Share by IC Tray Revenue in 2024
Source: Above companies; Secondary Sources and Bosson Research, 2025
Key players in the IC Tray Market include:
Daewon
Entegris
Mishima Kosan
ITW
Sunrise
Peak International
HWA SHU
NISSEN CHEMITEC CORPORATION
SHINON
Kostat
Shenzhen Hiner Technology Co.,LTD.
Baiyu Packaging Material Tech Co., Ltd.
Tateyama
ZSPAK
RH Murphy Company
TOMOE Engineering
ePAK International
Zhejiang Jiemei Electronic And Technology Co.,Ltd.
CHYANG YEOU
Daiwa
Others
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