Market Insight-Global Prepreg for PCB Market Overview 2024
Global Prepreg for PCB Market Was Valued at USD 2645.10 million in 2022 and is Expected to Reach USD 3404.47 Million by the End of 2029, Growing at a CAGR of 4.46% Between 2023 and 2029.– Bossonresearch.com
Prepreg, also referred to as pre-impregnated composite fibers, is a key material used in the manufacture of multilayer printed circuit boards (PCBs). It is a fibrous reinforcement that has been pre-impregnated with a resin system prior to laminating PCB layers together.Prepregs provide electrical isolation between the conductive copper layers in a PCB while also offering mechanical stability. They impart crucial properties like dimensional stability, bond strength, heat resistance and dielectric performance. Selecting the right prepreg material is critical for the reliability of multilayer PCBs used in electronics.
The global Prepreg for PCB market size is projected to reach US$ 3404.47 Million by 2029 from US$ 2645.10 million in 2022 at a CAGR of 4.46% during 2023-2029. Traditional applications such as consumer electronics, communication equipment and computers dominate the demand for PCBs, and their development has become the core driving force for the development of the PCB prepreg market. At the same time, the automotive industry is increasingly focusing on advanced electronics, including electric vehicles, ADAS and in-vehicle connectivity. Integration of artificial intelligence into PCs, driven by neural network chips (NPUs), is another driver for the PCB prepreg market. High-end servers are driving the growth of the PCB prepreg market, driven by technology upgrades at higher speeds and frequencies. Additionally, the miniaturization of electronic components and the development of high-density interconnections are driving the demand for PCB prepreg materials. Prepreg materials can create thinner, more compact PCBs without compromising functionality.
Figure Global Prepreg for PCB Market Size
Source: Bossonresearch.com, 2024
Driving Factors
Terminal demand expands into emerging applications
Consumer electronics, communication equipment and computers are the main traditional application areas of PCB, accounting for nearly 71% of PCB terminal demand in 2022. In the future, the rapid growth of downstream emerging fields such as 5G communications, automotive electronics, industrial medical care, and aerospace will promote the PCB industry to gradually develop in the direction of high multi-layer, high density, and high integration, and the demand for high-end products such as multi-layer boards, HDI boards, high-frequency high-speed boards, and packaging substrates will increase rapidly. With the rapid development of electronic circuit industry technology, component integration functions are increasingly extensive, and the high-density requirements of PCB in electronic products are more prominent. In the future, the growth of package substrate, HDI board, 8-layer and more multilayer board is expected to be faster than other categories, according to Prismark data forecast, 2022-2027, package substrate (IC carrier board), HDI board and multilayer board compound annual growth rate of 5.1%, 4.4% and 3.4%, respectively. The increasing demand for consumer electronics, automotive, and communication products is driving the demand for PCB prepreg materials.
Demand from the Automotive Industry The automotive industry's emphasis on advanced electronics, including electric vehicles, advanced driver-assistance systems (ADAS), and in-vehicle connectivity, boosts the demand for high-performance PCBs. Prepreg materials contribute to the reliability and performance of PCBs used in automotive applications.
Artificial Intelligence and Neural Network Chip Integration
Artificial intelligence applications, especially the emergence of large-scale models, are changing daily office work. The integration of artificial intelligence into PCs, driven by neural network chips (NPUs), is a key driver of the PCB market.
As artificial intelligence applications become more common, manufacturers such as Intel are integrating NPUs into the central processing units (CPUs) of personal computers. This shift in personal computer capabilities is expected to increase the demand for PCBs that support these AI-driven functions. This will drive the development of PCB prepreg market.
Server upgrades and high-speed PCB development
High-end servers include backplanes, digital line cards and HDI cards, which feature high digital capabilities, high aspect ratios, high density and high transmission rates. HDI boards are critical to meeting the design requirements of these advanced server applications. The development of servers, driven by upgrades to accommodate higher speed and higher frequency processing, is a significant driver of PCB prepreg market growth. The rise of 5G, cloud computing, artificial intelligence, big data and other technologies has driven the demand for high-performance servers. This in turn has increased the demand for advanced PCBs with features such as higher layer count, larger size, high aspect ratio, high density and high-speed material applications.
Technological Advancements Technological advancements such as miniaturization of electronic components and the development of high-density interconnects are driving the demand for PCB prepreg materials. The ongoing trend of miniaturization in electronic components requires PCBs with higher density and reliability. Prepreg materials facilitate the creation of thinner and more compact PCBs, allowing for the miniaturization of electronic devices without compromising functionality. The increasing demand for high-performance PCBs is also driving the demand for PCB prepreg materials.
Industrial organization innovation
Companies in the PCB prepreg market focus on product innovation to stand out. Innovations in prepreg materials, such as halogen-free alternatives, flame retardant properties and high thermal properties, help increase market competitiveness.
In addition, improvements in manufacturing processes, including efficient lamination technology and environmentally friendly production methods, have increased the overall efficiency of the industry.
Key Development Trends
Prepreg materials are becoming increasingly important in PCBS
The prepreg forms the basic dielectric building block of the multilayer PCB, which enables the electrical isolation of the conductive layer while also having mechanical strength. The composition of the resin, fabric reinforcement material and filler that make up the prepreg determines the thermal, electrical and reliability properties of the PCB. Due to the wide variety of prepreg types available, PCB manufacturers can choose the best material for their performance requirements and process compatibility. Strict handling and quality control measures for prepregs also minimize variability and ensure consistent results during PCB manufacturing. As PCBS become thinner and operate at higher frequencies and temperatures, the design of prepreg materials is critical to achieving the miniaturization and reliability of PCBS.
The global PCB industry is slowing down
Affected by geopolitics, inflation and other factors, the growth rate of the global PCB industry has slowed down. In the medium to long term, Asia will continue to dominate the global PCB industry, still dominated by China. In 2022, the global electronic complete machine market demand further declined, communications, consumer electronics, energy, 2022 global electronic complete machine market demand further declined, communications, consumer electronics, energy, automotive and other industries market demand continued to decline. End customers adjust inventory and reduce supply, which has an impact on the PCB industry. According to Prismark statistics, it is expected that the total output value of the global PCB industry in 2022 will grow by 2.9% year-on-year, and the Chinese mainland will grow by 0.1% year-on-year, while the global growth in 2021 will grow by 24.1% year-on-year, and the Chinese mainland will grow by 25.7% year-on-year.
Asia Leads, China Core in Global PCB Industry
With the global electronic information industry from developed countries to emerging economies and emerging countries, Asia, especially China, has gradually become the world's most important electronic information product production base. Since 2013, the PCB output value in Asia has accounted for more than 90% of the global PCB output value, and the global PCB industry has formed an industrial pattern with Asia as the leading and China as the core.
According to Prismark statistics, the global PCB output value in 2021 is 80.92 billion US dollars, Asia accounts for 86.39%, China accounts for 54.6%, and the global PCB output value in 2022 is expected to be 83.256 billion US dollars, Asia accounts for 86.7%, of which China accounts for 53.8%. It is expected that by 2026, the global PCB output value is expected to reach $101.559 billion, with Asia accounting for 85.61%, of which China accounts for 53.8%. Therefore, in the medium and long term, Asia will still dominate the PCB industry, and it is still dominated by China.
Growing Adoption of Multilayer PCBs
Today's electronic devices are increasingly moving towards more complex and feature-rich designs. For example, PCBS such as smartphones, tablets and Internet of Things devices require higher performance and denser circuits. Consumer demand for thin and short electronic devices is increasing, such as ultra-thin laptops, smart watches and so on. Multilayer PCBS are able to provide more functionality in a smaller space, meeting the requirements for the appearance and size of the device. The trend towards more complex and compact electronic devices leads to an increased adoption of multilayer PCBs. Prepreg materials play a crucial role in the lamination process of creating multilayered PCBs, providing insulation and structural support between layers. The continuous increasing demand for multilayer PCBS makes them a key growth driver in the PCB preimpregnation materials market.
Copper Clad Plate Industry Sees New Development Opportunities
The vigorous development of new industries has driven the development of high-performance computing and processing chips, IC carrier boards, vehicle and digital energy, which has brought development opportunities to the copper-clad plate industry. At present, the terminal application of copper clad plate involves almost all electronic products. With the vigorous development of industries represented by 5G technology, cloud computing, data centers, the Internet of Things, artificial intelligence, new energy vehicles, intelligent driving and smart homes, the copper clad plate industry has brought new development opportunities, and also put forward higher requirements and standards. As the upstream of the PCB industry, downstream multi-layer board or HDI customers to purchase copper clad plate manufacturers, often need to purchase the corresponding prepeg products, using it as the bond and insulation material between the multi-layer board or HDI layer and layer.
PCB layer count and density continue to increase
As electronic products develop towards thinner, lighter and smaller products, high-density requirements are placed on PCBs. The number of components that need to be mounted on PCBs continues to increase but the required sizes continue to shrink. Against this background, the width and spacing of PCB wires, the diameter and hole center distance of micro-hole disks, and the thickness of conductor layers and insulating layers are all constantly changing. decline. HDI is a circuit board that uses micro-blind buried via technology and has a high circuit distribution density. According to the difficulty of manufacturing, HDI can be further divided into first-order, second-order, third-order, fourth-order and above, any layer (Any Layer) and SLP, etc., among which SLP has more advantages than traditional low-end HDI products in terms of number of layers and line width and line spacing. Compared with traditional PCB, HDI board can achieve smaller aperture, thinner line width, fewer through holes, save PCB routing area, greatly increase component density, improve radio frequency interference/electromagnetic wave interference/electrostatic discharge, etc.; SLP Based on HDI, the line width/line spacing is reduced from 40/40 microns to 30/30 microns, with more stacking layers, smaller line widths and spacing, and can carry more functional modules, with significant performance advantages.
Global Prepreg for PCB Market: Competitive Landscape
According to our calculations, the two indicators used to measure market concentration, CR5 and HHI, have reached 62.87% and 10.22% respectively in 2022. This means that leading companies occupy a major market share, but the overall market concentration is not high, and companies in the industry are still in fierce competition. Currently, the major players in the market include Shengyi Technology, Elite Material Co. Ltd., ITEQ Corporation, Isola Group, AGC, Nanya New Material Tech, Taiwan Union Technology Corporation, GDM International Technology Ltd., Ventec International Group, Rogers Corporation, Guangdong Goworld Lamination Plant, PCBtok, etc.
Figure The Global 5 Largest Players: Market Share by Prepreg for PCB Revenue in 2022
Source: Bossonresearch.com, 2024
Key players in the Prepreg for PCB Market include:
Shengyi Technology
Elite Material Co. Ltd.
ITEQ Corporation
Isola Group
AGC
Nanya New Material Tech
Taiwan Union Technology Corporation
GDM International Technology Ltd.
Ventec International Group
Rogers Corporation
Guangdong Goworld Lamination Plant
PCBtok
Others
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